There are many factors to consider when aiming to establish and maintain power integrity, from cavity thickness to the presence or absence of a voltage regulator.
Written by signal/power integrity specialist Fadi Deek of Mentor, A Siemens Business, this micro eBook provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.
After you've read this eBook, you will better understand cause-effect relationships between varying factors and how to consider these when making design decisions.
In 2005, Fadi received his B.S. degree in computer and communications from the American University of Science and Technology (AUST) in Beirut, Lebanon. That same year, he joined Fidus Systems as a design engineer. He designed circuit boards at Fidus for three years. In 2010, he received his M.S. in electrical engineering from the University of Arkansas in Fayetteville. He then joined Mentor, A Siemens Business, as a corporate marketing engineer. In 2013, Deek became a corporate application engineer supporting the HyperLynx tool suite. In parallel, he is also pursuing his Ph.D. at the University of Colorado in Boulder under the supervision of Dr. Eric Bogatin.
Mentor, A Siemens Business, is a world leader in electronic hardware and software design solutions providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Website: www.mentor.com.
One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-Thermal co-simulation to properly characterize. With HyperLynx PI you can quickly pinpoint problems in your PCB's power distribution network.
Dean, Signal Integrity Academy
Consulting Technical Editor, I-Connect007
Chapter 1: Bare Cavity
Chapter 2: Decoupling Capacitor and VRM Effects
Chapter 3: Transparent Cavity
Chapter 4: Cavity Noise and Via-to-Via Coupling
Chapter 5: Reducing Via-to-Via Coupling Using Capacitors
What Our Readers Are Saying
The Printed Circuit Designer’s Guide to… Power Integrity by Example from Mentor, A Siemens Business, explores the specific problem of via-to-via coupling through a cavity starting from the ground floor.Eric Bogatin
This micro eBook should be required reading for every PCB designer or design engineer, whether novice or veteran. This book makes a great follow-up to Mentor’s previous eBook, The Printed Circuit Designer’s Guide to…Signal Integrity.Andy Shaughnessy
Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples.Gene Garat, President, Moss Bay EDA